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An earthquake of magnitude 4.0 occurred in the waters near the Fukushima Daiichi nuclear power plant in Japan. According to Japanese media reports, an earthquake of magnitude 4.0 occurred on the morning of the 12th local time in the eastern coastal area of Fukushima Prefecture, Japan, with a focal depth of 50 kilometers. Fukushima Prefecture has a sense of earthquake in many places, including Urachi-CHO, Langjiang-CHO and Yuye-CHO, among which Urachi is the location of Units 1 to 4 of the Fukushima Daiichi nuclear power plant. (CCTV News)Turkey imposes additional tax on Iranian flat glass imports.The main fuel contract rose by 4.00% in the day and is now reported at 3188.00 yuan/ton.

Employees demand to pay social security. Xia Yiping: The problems are all being solved. If you escape, you won't come. Some netizens posted a video showing that Xia Yiping, CEO of Ji Yue, was surrounded by employees in the company, and some employees shouted at Xia Yiping: "Take out your savings and pay social security to employees." Some employees at the scene said that if social security is broken, how many people will be affected, don't talk empty talk. Xia Yiping responded that knowing that everyone is very angry, everyone has followed us for so long, and I am very grateful. "These problems are being solved. Now I am communicating with you. If I escape, I will not come." Xia Yiping, CEO of Extreme Vietnam, issued an internal letter on the afternoon of the 11th, acknowledging that the company was encountering difficulties and needed immediate adjustment. (Sina Technology)Another member of South Korea's ruling party said he would vote to impeach President Yoon.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)

South Korean police tried to search Cheongwadae's office again.Indian Rupee's exchange rate against the US dollar fell below 84.86, a record low.The main fuel contract rose by 4.00% in the day and is now reported at 3188.00 yuan/ton.